Semiconductor device and method of manufacturing thereof

ABSTRACT

The present invention relates to a semiconductor device in which a semiconductor element and a substrate are disposed face-to-face, the mixture of the thermoplastic resin and the thermosetting resin is provided between the semiconductor element having the electrode formed thereon and the substrate having the wiring pattern formed thereon, the mixture holding in contact the electrode of the semiconductor element and the wiring pattern of the substrate. The semiconductor device of the present invention is obtained by: providing a sealing resin, which is a mixture of a thermoplastic resin and a thermosetting resin, between the semiconductor element and the substrate; heating at a temperature greater than a melting temperature of the thermoplastic resin; applying pressure to the sealing resin so that it spreads through the space between the semiconductor element and the substrate; melt-bonding the semiconductor element and the substrate through a cooling contraction of the thermoplastic resin component; and heating at a temperature less than a melt bond temperature of the thermoplastic resin component to cure the thermosetting resin component.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a semiconductor device in whichconnection between constituent parts is realized by an insulating resinfor bonding and sealing, and to a production method thereof.

[0003] 2. Description of the Related Art

[0004] There is known a method for mounting a semiconductor device,where electrical and mechanical connections between a semiconductorelement and a substrate are realized by a holding power of athermosetting insulating resin. As an example of such a method, steps ofmounting a semiconductor element in Laid-Open Patent Application No.10-223686 are illustrated in cross-section in FIGS. 1A and 1B. First, asubstrate 17 and a semiconductor element 11 are loaded onto a mountingmachine. Then, as shown in FIG. 1A, an insulating resin 13 for bondingand sealing (hereinafter, referred to as “sealing resin”) is applied tothe substrate 17 made of ceramic, glass, glass-epoxy, etc. on the sidethereof where a wiring pattern 16 is provided.

[0005] The wiring pattern 16, which is made of Cr—Au, Al, Cu, ITO, etc.,is formed by forming on the substrate 17 a metal layer by sputtering orvapor deposition, forming on the metal layer a resist having the wiringpattern 16 by a photo resist method, and etching the metal layer but theresist. The wiring pattern 16 may also be formed by printing or plating.The sealing resin 13 is a thermosetting resin such as epoxy resin,silicone resin, acrylic resin, etc.

[0006] Formed on an aluminum electrode of the semiconductor element 11by electroplating, etc. is a protruding electrode 12 made of Au, Ag orCu. The semiconductor element 11 is adsorptively held by a jig fixture18 for pressing, heating and aligning purposes (hereinafter, referred toas “sealing jig fixture”) on the side thereof opposite to where theprotruding electrode 12 is formed.

[0007] Next, as shown FIG. 5B, while aligning the protruding electrode12 of the semiconductor element 11 with the wiring pattern 16 by thesealing jig fixture 18, the semiconductor element 11 is pressed onto thesubstrate 17. When the protruding electrode 12 formed on the aluminumelectrode of the semiconductor element 11 is pressed against thesubstrate 17, the thermosetting sealing resin 13 between the protrudingelectrode 12 and the wiring pattern 16 is forced out of the spacetherebetween, and the protruding electrode 12 and the wiring pattern 16are electrically connected.

[0008] Then, while maintaining the pressure, the sealing resin 13 iscured by providing heat thereto from the sealing jig fixture 18. Later,the pressure is released, and the bonding of the semiconductor element11 to the substrate 17 is completed. When this process is finished, theprotruding electrode 12 of the semiconductor element 11 and the wiringpattern 16 of the substrate 17 are held together by the contractileforce of the thermosetting sealing resin 13, thereby maintaining theirelectrical connection.

[0009] As described above, it has now been discovered that in aconventional method of mounting the semiconductor element, where theliquid sealing resin is cured by providing heat while maintaining thepressure between the semiconductor element and the substrate by asealing jig fixture, the pressure provided by the sealing fixture cannotbe released until the curing of the thermosetting sealing resin iscompleted. Furthermore, although it is preferable that a sealing resinhaving a high glass transition temperature be used for better connectionreliability, it generally takes more than 10 sec for such athermosetting sealing resin to be cured, meaning that an expensivemounting machine is inevitably occupied for a long period of time and,therefore, the production cost cannot be reduced.

SUMMARY OF THE INVENTION

[0010] It is an object of the present invention to provide asemiconductor device and a production method thereof, in which timerequired to complete the mounting of a semiconductor element on asubstrate can be shortened, thereby reducing a production cost.

[0011] A semiconductor device of the present invention is characterizedin that the first constituent member having an electrode formed thereonand the second constituent member having an electrode formed thereon aredisposed face-to-face, and that a mixture of a thermoplastic resin and athermosetting resin is provided between the first constituent memberhaving an electrode formed thereon and the second constituent memberhaving an electrode formed thereon, the mixture holding in contact theelectrode of the first constituent member and the electrode of thesecond constituent member. The present invention is also characterizedin that the semiconductor element having an electrode formed thereon andthe substrate having a wiring pattern formed thereon are disposedface-to-face, and that a mixture of a thermoplastic resin and athermosetting resin is provided between the semiconductor element havingan electrode formed thereon and the substrate having a wiring patternformed thereon, the mixture holding in contact the electrode of thesemiconductor element and the wiring pattern of the substrate.Furthermore, the present invention is characterized in that the meltingtemperature of the thermoplastic resin in the mixture is greater thanthe glass transition temperature of the thermosetting resin, and thatthe modulus of elasticity of the thermoplastic resin is less than themodulus of elasticity of the thermosetting resin. Moreover, the presentinvention is characterized in that X·E₁·α₁<(1−X)·E₂·α₂ holds, where E₁is the modulus of elasticity of the thermoplastic resin, α₁ is thecoefficient of thermal expansion of the thermoplastic resin, E₂ is themodulus of elasticity of the thermosetting resin, α₂ is the coefficientof thermal expansion of the thermosetting resin, and X is the content bypercentage of the thermoplastic resin in the mixture and 0<X<1. It ispreferable that the modulus of elasticity of the thermoplastic resin E₁be less than the modulus of elasticity of the thermosetting resin E₂. Itis also preferable that X be in the range from 0.4 to 0.6, that thethermoplastic resin be thermoplastic polyimide resin, and that thethermosetting resin be epoxy resin.

[0012] A method for producing a semiconductor device according to thepresent invention is characterized in that it includes steps of:providing a mixture of thermoplastic resin component and thermosettingresin component between the first constituent member and the secondconstituent member; heating at a temperature greater than the meltingtemperature of the thermoplastic resin component; applying pressure tothe mixture so that it spreads through the space between the firstconstituent member and the second constituent member; completing themelt bonding of the first constituent member and the second constituentmember through cooling contraction of the thermoplastic resin component;and heating at a temperature less than the melt bond temperature of thethermoplastic resin component to cure the thermosetting resin component.A method for producing a semiconductor device according to the presentinvention is also characterized in that it includes steps of: providinga mixture of thermoplastic resin component and thermosetting resincomponent between the semiconductor element and the substrate; heatingat a temperature greater than the melting temperature of thethermoplastic resin component; applying pressure to the mixture so thatit spreads through the space between the semiconductor element and thesubstrate; completing the melt bonding of the semiconductor element andthe substrate through cooling contraction of the thermoplastic resincomponent; and heating at a temperature less than the melt bondtemperature of the thermoplastic resin component to cure thethermosetting resin component.

[0013] Conventionally, since a liquid thermosetting resin alone was usedas the sealing resin, the mounting machine must remains in the state ofbeing loaded with a semiconductor element to be mounted until thethermosetting resin is cured in order to obtain a firm press bonding. Inthe present invention, melt bonding due to the thermoplastic resincomponent constituting a sealing material is utilized in the mounting ofa semiconductor element. The thermoplastic resin component in a mixture,which melts upon heating and being pressurized and spreads through thespace between the semiconductor element and the substrate, is cooleddown quickly when a heat source is removed, thereby reducing timerequired for mounting a semiconductor element. When this is being done,a thermal contractile force of the resin due to cooling acts between thesemiconductor element and the substrate, and the electrode of thesemiconductor element and the wiring pattern of the substrate are heldtogether in electrical connection. Then, the thermosetting resincomponent constituting the mixture is cured. Here, the curingtemperature of the thermosetting resin component is chosen to be lessthan the melting temperature of the thermoplastic resin component.Therefore, reheating up to the curing temperature does not completelynullify the thermal contractile force due to the thermoplastic resincomponent, and the state of pressure bond between the electrode of thesemiconductor element and the wiring pattern of the substrate ismaintained. When the thermosetting resin component is cured, acontractile force due to the curing of the thermosetting resin componentcomes into play, further enhancing the connection reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other objects, advantages and features of thepresent invention will be more apparent from the following descriptiontaken in conjunction with the accompanying drawings, in which:

[0015]FIGS. 1A and 1B are cross-sectional views illustrating the stepsfor mounting a semiconductor element in a prior art.

[0016]FIGS. 2A, 2B and 2C are cross-sectional views illustrating thesteps for producing a semiconductor device of the present invention in astep-wise manner;

[0017]FIGS. 3A to 3C are flow-chart describing the steps for producing asemiconductor device of the present invention;

[0018]FIG. 4 is a graph illustrating the change of heating temperatureduring the production of a semiconductor device of the presentinvention; and

[0019]FIG. 5 is a graph illustrating the change of volume of the sealingresin during the production of a semiconductor device of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The invention will be now described herein with reference toillustrative embodiment. Those skilled in the art will recognize thatmany alternative embodiments can be accomplished using the teachings ofthe present invention and that the invention is not limited to theembodiment illustrated for explanatory purposes.

[0021] Preferred embodiment of the present invention will be describedwith reference to FIGS. 2A to 2C and 3. FIGS. 2A to 2C arecross-sectional views illustrating the steps of producing asemiconductor device of the present invention in a step-wise manner, andFIG. 3 is a flow-chart describing the production steps of FIGS. 2A to2C.

[0022] A semiconductor device in this embodiment and a mounting methodtherefor will be described as follows. First, as shown in FIG. 2A, asubstrate 7 and a semiconductor element 1 are loaded onto a mountingmachine (step 301). Here, the substrate 7 is made of ceramic, glass,glass-epoxy, etc., and formed thereon is a wiring pattern 6 made ofCr—Au, Al, Cu, ITO, etc. by forming on the substrate 7 a metal layer bysputtering or vapor deposition, forming on the metal layer a resisthaving the wiring pattern 6 by a photo resist method, and etching themetal layer but the resist. The wiring pattern 6 may also be formed byprinting or plating.

[0023] Formed on an aluminum electrode of the semiconductor element 1 isa protruding electrode 2 made of Au, Ag or Cu and having a pointed shapeby electroplating or ball bonding. The semiconductor element 1 isadsorptively held on the surface thereof opposite to where theprotruding electrode 2 is formed by a sealing jig fixture 8.

[0024] Next, a sealing resin 3, which is a mixture of a thermoplasticresin and a thermosetting resin, is provided onto an area on thesubstrate 7 where the semiconductor element 1 is to be mounted (step302). The sealing resin is appropriately selected while taking intoconsideration the flowability during heating, mechanical propertiesafter the curing, thermal properties, etc. Preparation of a mixture as asealing resin is not limited to any particular manner, and it can beprepared, for example, by first dissolving thermoplastic resincomponents into a solvent and uniformly dispersing liquid thermosettingresin components thereinto and then removing excess solvent. Here, as apreferable example, the thermoplastic resin component is chosen to besilicone-denatured polyimide, which is one of thermoplastic polyimideshaving high heat resistance (glass transition temperature is about 230°C.; melting temperature is 280 to 300° C.), and the thermosetting resincomponent is chosen to be acid anhydride epoxy which is one of epoxyresins (glass transition temperature is about 150° C.). The sealingresin 3 may be liquid or in the form of a sheet so long as it melts at apressure bonding temperature and hardens at the cooling thereafter. Thesealing resin 3 may be provided to the semiconductor element 1beforehand.

[0025] Next, the heating of the semiconductor element 1 by the sealingjig fixture 8 is started (step 303).

[0026] Next, the sealing jig fixture 8 is brought into motion in such amanner that the protruding electrode 2 of the semiconductor element 1 isaligned with the wiring pattern 6 of the substrate 7 (step 304), and thesemiconductor element 1 is pressed against the substrate 7 as indicatedby an arrow in the figure (step 305). When this is being done, thethermoplastic resin component of the sealing resin 3 not only melt butis forced out of the space between the substrate 7 and the semiconductorelement 1 while the protruding electrode 2 formed on the aluminumelectrode of the semiconductor element 1 and having a pointed shape ismaking sufficient contact with the wiring pattern 6 of the substrate 7.By bringing the sealing jig fixture 8 away from the semiconductorelement 1, the melted thermoplastic resin component is cooled quicklyand hardened, thereby securing the electrical connection (step 306).Incidentally, a time interval during which the heating by the sealingjig fixture 8 is halted may be provided just before the end of thepressing cycle. In that case, the sealing jig fixture 8 can be broughtaway from the semiconductor element 1 while the thermoplastic resincomponent is already in the state of having been cooled, therebyenhancing the connection reliability. As described here, the electrodeof the semiconductor element and the wiring pattern of the substrate arefixed to each other with the sealing resin with their positions beingproperly aligned to each other. The electrical connection between theelectrode of the semiconductor element and the wiring pattern of thesubstrate is realized by maintaining the physical contact therebetweenby a holding power of the sealing resin, with the semiconductor elementand the substrate being mechanically connected with the sealing resin.

[0027] In the case where the thermoplastic resin component is siliconedenatured polyimide, the heating by the sealing jig fixture 8 isconducted at a temperature above 280 to 300° C. (melting temperature)and below that which does not damage the semiconductor element 1 and thesubstrate 7 for a period of 2 to 10 sec, or preferably 2 to 5 sec, ormore preferably 2 to 3 sec. Then, if the sealing jig fixture 8 isbrought away from the semiconductor element 1, the sealing resin 3 isnaturally cooled down below the melting temperature, and thethermoplastic resin component is hardened. During this cycle, thethermosetting resin component, which is mixed in the sealing resin, isnot cured for the reasons that the heating period is short, that thethermoplastic resin is present, etc. and other curing inhibitingfactors.

[0028] Next, as shown in FIG. 2B, the semiconductor element 1 and thesubstrate 7, which are fixed to each other with the sealing resin 3, areunloaded from the mounting machine (step 307). When this is being done,the sealing resin 3, which exists between the semiconductor element 1and the substrate 7 and has been cooled to a room temperature holdstogether the protruding electrode 2 and the wiring pattern 6 of thesubstrate 7 by thermal contraction (step 308). The force of thermalcontraction, which is in the direction of thickness and holds togetherthe protruding electrode 2 and the wiring pattern 6, is expressed asΔT×α×E, where typical values for α and E are 60 to 120 ppm and 1 to 10Gpa, respectively, in the case of silicone-denatured polyimide. Here, anexample is given of a sealing resin where the volume ratio ofsilicone-denatured polyimide which is in a solid state at roomtemperature to thermosetting resin which is in a liquid state at roomtemperature is 1 to 1, that is, a content by percentage of siliconedenatured polyimide, X, is 0.5. In the case of silicone denaturedpolyamide, where α=120 ppm and E=1 GPa, if ΔT=(glass transitiontemperature)−(room temperature)=230−25=215° C., then the initialcontractile force due to the silicone-denatured polyamide becomesX×ΔT×α×E=12.9 MPa. Here, since the curing of the thermosetting resincomponent hardly proceeds if the heating ends in a short period of time,its contribution to the initial contractile force is negligible, and itis excluded from consideration. Moreover, even if the thermosettingresin component is in the state of solid, it is in the uncured state andits modulus of elasticity is small, hardly contributing to thecontractile force.

[0029] Next, as shown in FIG. 2C, the semiconductor element 1 and thesubstrate 7 which are fixed to each other with the sealing resin 3 arereheated (step 309) to cure the thermosetting resin. In the presentembodiment, since a thermosetting resin whose glass transitiontemperature, one of the post-curing characteristics, is 150° C. has beenchosen, the reheating is conducted at 150° C. During this reheatingcycle, the temperature of the whole resin rises to 150° C., and theinitial contractile force of the thermoplastic resin component decreasesby 7.5 MPa, or specifically, it becomes 12.9 MPa−7.5 MPa=5.4 MPa. Thisis the thermal contractile force due to the thermoplastic resincomponent of the sealing resin 3, which holds together the protrudingelectrode 2 and the wiring pattern 6 of the substrate 7. Therefore, thethermosetting resin component of the sealing resin 3 is cured with theprotruding electrode 2 and the wiring pattern 6 being electricallyconnected (step 310).

[0030] The contractile force due to the curing reaction of thethermosetting resin component adds to 5.4 MPa, which is the contractileforce due to the thermoplastic resin component at the temperature of150° C. After the curing, the sealing resin is cooled to roomtemperature. When this is being done, if acid anhydride epoxy has beenchosen to be the thermosetting resin component, then E=4 Gpa and α=60ppm, and a contractile force given by (1−X)×ΔT×α×E=15 MPa resultsthrough the thermo-contraction of the thermosetting resin component dueto cooling. This contractile force holds together the protrudingelectrode 2 and the wiring pattern 6 more firmly, thereby enhancing theconnection reliability (step 311).

[0031] Incidentally, depending on the deformation property of thesubstrate 7, the pressure applied during heating may be maintained untileither before or after the fall of the temperature so long as it doesnot induce any deformation.

[0032] The relationship between the characteristic values ofthermoplastic resin and thermosetting resin is:

[0033] (Melting temperature of thermoplastic resin)>(Glass transitiontemperature of thermosetting resin); and

[0034] X·E₁·α₁<(1−X)·E₂·α₂.

[0035] Here, E₁ is a modulus of elasticity of thermoplastic resin, α₁ isa coefficient of thermal expansion of thermoplastic resin, E₂ is amodulus of elasticity of thermosetting resin, α₂ is a coefficient ofthermal expansion of thermosetting resin, and X is a content bypercentage of the thermoplastic resin in the mixture with 0<X<1. Bysetting the contractile force of the thermosetting resin component,which is cured in the latter steps, to be greater than that ofthermoplastic resin component, high connection reliability can beobtained. Considering the process stability and the connectionreliability, it is preferable that X be in the range from 0.4 to 0.6.

[0036] Moreover, it is still more preferable that E₁<E₂ holds.

[0037]FIG. 4 illustrates the change of heating temperature during thesteps shown in FIGS. 2A to 2C, and FIG. 5 illustrates the change ofvolume of the sealing resin.

[0038] The sealing resin decreases in volume (corresponding to A in FIG.5) during the final cooling process indicated by the interval (a) inFIG. 4 where melted resin is cooled and hardened, and the resultingcontractile force of the sealing resin holds the electrode of thesemiconductor element and the wiring pattern of the substrate inconnection. Next, the reheating is conducted until the curingtemperature is reached so that the thermosetting resin component in thesealing resin is cured. Although the volume of the sealing resinincreases (corresponding to B in FIG. 5) during this reheating, thereheating temperature is chosen to be lower than the melt bondtemperature. Therefore, this volume increase does not cancel or gobeyond the contraction due to the cooling process therebefore, and theprotruding electrode and the wiring pattern stay in connection. Then, byheating the thermosetting resin component for a prescribed duration, thethermosetting resin component is cured and contracted (corresponding toC in FIG. 5). The sealing resin decreases in volume once again whencooled down to room temperature after the thermosetting resin componentis cured. That is, a contact force between the protruding electrode andthe wiring pattern is strengthened more than at the time of placement ofthe semiconductor element by an amount of contraction of thethermosetting resin (corresponding to C in FIG. 5), thereby enhancingthe sealing reliability.

[0039] Although, in the embodiment of the present invention describedabove, the connection of a semiconductor element to a substrate wasdescribed, it is clear that this invention is not limited to that casebut may be equally applied to the connection between other constituentparts.

[0040] As described above, the present invention can be utilized toreduce time during which the mounting machine is loaded with asemiconductor element. Accordingly, the output of the expensive mountingmachine can be improved, and the cost of production can be reduced.Moreover, since the placement of the semiconductor element is conductedonly by the melt bonding of thermoplastic resin component, time requiredfor the placement of the semiconductor element can be shortened. Sincethermosetting resin component is cured at a temperature lower than themelt bond temperature of thermoplastic resin component, thethermoplastic resin making a melt bonding expands during reheating.However, by choosing the reheating temperature to be lower than the meltbond temperature, this volume increase does not cancel or go beyond thecontraction due to the cooling process therebefore. Hence, theprotruding electrode and the wiring pattern stay in connection, and thecontact force between the protruding electrode and the wiring pattern isstrengthened more than at the time of placement of the semiconductorelement by an amount of contraction of the thermosetting resin, therebyenhancing the sealing reliability. By choosing a modulus of elasticityof the thermosetting component to be higher than that of thethermoplastic component, the contact force between the protrudingelectrode and the wiring pattern does not weaken even if they are heatedafter the curing.

[0041] It is apparent that the present invention is not limited to theabove embodiment, but may be modified and changed without departing fromthe spirit and scope of the invention except as defined in the appendedclaims.

What is claimed is:
 1. A semiconductor device comprising: a first constituent member having an electrode formed thereon; a second constituent member having an electrode formed thereon; and a mixture of a thermoplastic resin and a thermosetting resin, wherein said first constituent member and said second constituent member are disposed face-to-face, said mixture of said thermoplastic resin and said thermosetting resin is provided between said first constituent member having said electrode formed thereon and said second constituent member having said electrode formed thereon, said mixture holding in contact the electrode of said first constituent member and said electrode of the second constituent member.
 2. A semiconductor device comprising: a semiconductor element having an electrode formed thereon; a substrate having a wiring pattern formed thereon; and a mixture of a thermoplastic resin and a thermosetting resin, wherein said semiconductor element and said substrate are disposed face-to-face, said mixture of said thermoplastic resin and said thermosetting resin is provided between said semiconductor element having said electrode formed thereon and said substrate having said wiring pattern formed thereon, the mixture holding in contact the electrode of said semiconductor element and said wiring pattern of said substrate.
 3. A semiconductor device according to claim 1, wherein a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
 4. A semiconductor device according to claim 2, wherein a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
 5. A semiconductor device according to claim 3, wherein X·E₁·α₁<(1−X)·E₂·α₂ holds, where E₁ is a modulus of elasticity of said thermoplastic resin, α₁ is a coefficient of thermal expansion of said thermoplastic resin, E₂ is a modulus of elasticity of said thermosetting resin, α₂ is a coefficient of thermal expansion of said thermosetting resin, and X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
 6. A semiconductor device according to claim 4, wherein X·E₁·α₁<(1−X)·E₂·α₂ holds, where E₁ is a modulus of elasticity of said thermoplastic resin, α₁ is a coefficient of thermal expansion of said thermoplastic resin, E₂ is a modulus of elasticity of said thermosetting resin, α₂ is a coefficient of thermal expansion of said thermosetting resin, and X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
 7. A semiconductor device according to claim 5, wherein the modulus of elasticity E₁ of said thermoplastic resin is less than the modulus of elasticity E₂ of said thermosetting resin.
 8. A semiconductor device according to claim 6, wherein the modulus of elasticity E₁ of said thermoplastic resin is less than the modulus of elasticity E₂ of said thermosetting resin.
 9. A semiconductor device according to claim 5, wherein said X is in a range from 0.4 to 0.6.
 10. A semiconductor device according to claim 6, wherein said X is in a range from 0.4 to 0.6.
 11. A semiconductor device according to claim 1, wherein said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin.
 12. A semiconductor device according to claim 2, wherein said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin.
 13. A method for producing a semiconductor device comprising steps of: providing a mixture of thermoplastic resin component and thermosetting resin component between constituent parts; heating at a temperature greater than a melting temperature of said thermoplastic resin component; applying pressure to said mixture so that it spreads through a space between said constituent parts; completing a melt bonding of said constituent parts through a cooling contraction of said thermoplastic resin component; and heating at a temperature less than a melt bond temperature of said thermoplastic resin component to cure said thermosetting resin component.
 14. A method for producing a semiconductor device comprising steps of: providing a mixture of thermoplastic resin component and thermosetting resin component between a semiconductor element and a substrate; heating at a temperature greater than a melting temperature of said thermoplastic resin component; applying pressure to said mixture so that it spreads through a space between said semiconductor element and said substrate; completing a melt bonding of said semiconductor element and said substrate through a cooling contraction of said thermoplastic resin component; and heating at a temperature less than a melt bond temperature of said thermoplastic resin component to cure said thermosetting resin component.
 15. A method for producing a semiconductor device according to claim 13, wherein a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
 16. A method for producing a semiconductor device according to claim 14, wherein a melting temperature of said thermoplastic resin is greater than a glass transition temperature of said thermosetting resin.
 17. A method for producing a semiconductor device according to claim 15, wherein X·E₁·α₁<(1−X)·E₂·α₂ holds, where E₁ is a modulus of elasticity of said thermoplastic resin, α₁ is a coefficient of thermal expansion of said thermoplastic resin, E₂ is a modulus of elasticity of said thermosetting resin, α₂ is a coefficient of thermal expansion of said thermosetting resin, and X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
 18. A method for producing a semiconductor device according to claim 16, wherein X·E₁·α₁<(1−X)·E₂·α₂ holds, where E₁ is a modulus of elasticity of said thermoplastic resin, α₁ is a coefficient of thermal expansion of said thermoplastic resin, E₂ is a modulus of elasticity of said thermosetting resin, α₂ is a coefficient of thermal expansion of said thermosetting resin, and X is a content by percentage of said thermoplastic resin in said mixture and 0<X<1.
 19. A method for producing a semiconductor device according to claim 17, wherein the modulus of elasticity E₁ of said thermoplastic resin is less than the modulus of elasticity E₂ of said thermosetting resin.
 20. A method for producing a semiconductor device according to claim 18, wherein the modulus of elasticity E₁ of said thermoplastic resin is less than the modulus of elasticity E₂ of said thermosetting resin.
 21. A method for producing a semiconductor device according to claim 17, wherein said X is in a range from 0.4 to 0.6.
 22. A method for producing a semiconductor device according to claim 18, wherein said X is in a range from 0.4 to 0.6.
 23. A method for producing a semiconductor device according to claim 13, wherein said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin.
 24. A method for producing a semiconductor device according to claim 14, wherein said thermoplastic resin is thermoplastic polyimide resin and said thermosetting resin is epoxy resin. 